EoPlex Announces Improved Lead Carrier Substrate that Enables a "Super QFN" Semiconductor Package
REDWOOD CITY, Calif., April 14, 2011 /PRNewswire/ -- EoPlex Technologies, Inc. announced that its new xLC(TM) substrate, for Quad Flat No Lead semiconductor packages(QFNs),enables packaging companies to produce a "super QFN" with hundreds of leads and multiple rows at a lower cost than conventional packages. QFNs are the fastest growing packaging segment; however, they cannot be used in many ...
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